SnAgCu无铅焊点界面组织及抗拉强度在时效过程中的演变  

Evolution of Interfacial Intermetallic Compound and Tensile Strength of SnAgCu Lead-free Solder Joints during Aging Treatment Process

作　　者：姚健[1] 卫国强[1] 石永华[1] 

机构地区：[1]华南理工大学机械与汽车工程学院

出　　处：《特种铸造及有色合金》2011年第3期281-284,195,共4页Special Casting & Nonferrous Alloys

基　　金：国家自然科学基金(NSFC-广东联合)重点项目(U0734006)

摘　　要：采用扫描电镜(SEM)、能谱仪(EDS)和微拉伸试验,研究Cu/Sn-3Ag-0.5Cu/Cu引线对接焊点分别在100、125、150℃时效时焊点界面IMC的生长和抗拉强度的变化,同时对互连焊点的断口形貌及断裂模式进行了分析。结果表明,随着时效时间的延长,一是界面IMC不断增厚,其生长动力学符合抛物线生长规律,时效温度越高IMC生长速率越大,激活能为90kJ/mol;二是互联焊点的抗拉强度不断下降,其断裂模式由纯剪切断裂逐渐向微孔聚集型断裂转变。Growth of intermetallic compound of interface and tensile strength of Cu/Sn-3Ag-0.5Cu/Cu butting solder joints with aging treatment at 100, 125, 150 ℃ were investigated by SEM (scanning electron microscope), EDS (energy dispersive spectrometer and mechanical testing. Fracture morphology and fracture mode of the solder joint were evaluated. The results show that with increasing in aging time, thickness of interfacial IMC is increased, and its growth dynamics is accordant with parabolic law. The growth rate is accelerated with increasing in aging temperature, and activation energy reaches 90 kJ/mol. In addition, with increasing in aging time, tensile strength of the solder joint is decreased, and the fracture mechanism is transformed from pure shearing mode to micro-void accumulation one.

关 键 词：SnAgCu无铅焊点 时效 界面IMC 抗拉强度 断裂 

分 类 号：TG425.1[金属学及工艺—焊接]