Novel closed-form resistance formulae for rectangular interconnects  

作　　者：陈宝君 唐祯安 余铁军 

机构地区：[1]School of Electronic Science and Technology,Dalian University of Technology [2]School of Electronics and Information Engineering,Dalian Jiaotong University [3]Department of R&D,Sigrity Inc,Santa Clara,CA 95051,USA

出　　处：《Journal of Semiconductors》2011年第5期70-75,共6页半导体学报（英文版）

基　　金：Project supported by the National Natural Science Foundation of China(No.90607003).

摘　　要：Two closed-form formulae for the frequency-dependent resistance of rectangular cross-sectional interconnects are presented. The frequency-dependent resistance R （f） of a rectangular interconnect line or a intercon- nect line with a ground plane structure is first obtained by a numerical method. Based on the strict numerical results, a novel closed-form formula R（f） for a rectangular interconnect alone is fitted out using the Levenberg-Marquardt method. This R（f） can be widely used for analyzing on-chip power grid IR-drop when the frequency is changing. Compared to the previously published R（f） formula for an interconnect, the formula provided here is more accu- rate during the frequency transition range. Also for a bigger width to thickness ratio, this formula shows greater accuracy and robustness. In addition, this paper fits out the closed-form R（f） formula for a micro-strip-like inter- connect （an interconnect with a ground plane）, which is a typical structure in the on-chip or package power delivery system.Two closed-form formulae for the frequency-dependent resistance of rectangular cross-sectional interconnects are presented. The frequency-dependent resistance R （f） of a rectangular interconnect line or a intercon- nect line with a ground plane structure is first obtained by a numerical method. Based on the strict numerical results, a novel closed-form formula R（f） for a rectangular interconnect alone is fitted out using the Levenberg-Marquardt method. This R（f） can be widely used for analyzing on-chip power grid IR-drop when the frequency is changing. Compared to the previously published R（f） formula for an interconnect, the formula provided here is more accu- rate during the frequency transition range. Also for a bigger width to thickness ratio, this formula shows greater accuracy and robustness. In addition, this paper fits out the closed-form R（f） formula for a micro-strip-like inter- connect （an interconnect with a ground plane）, which is a typical structure in the on-chip or package power delivery system.

关 键 词：INTERCONNECT RESISTANCE Levenberg-Marquardt method 

分 类 号：TM152[电气工程—电工理论与新技术]