云南高校图书馆联盟文献共享服务平台- INTERCONNECT

INTERCONNECT: 作品数：131被引量：110H指数：5; 导出分析报告; 相关领域：自动化与计算机技术更多>>; 相关作者：蔡懿慈洪先龙汪蕙杨华中周强更多>>; 相关机构：清华大学上海华力微电子有限公司天津大学西安电子科技大学更多>>; 相关期刊：更多>>; 相关基金：国家自然科学基金国家重点基础研究发展计划国家高技术研究发展计划高等学校学科创新引智计划更多>>

Air-Sintering of Dual-Ligand Capped Copper Nanoparticles for High-Temperature Interconnect Applications: 《cMat》2025年第1期26-38,共13页Yu-Ji Zheng Jun-Jie Yuan Qing-Hua Li Zhe-Fei Sun Heng-Hui Wang Xiang Wu Ti-Xun Li Zi-Yu Zhou Shi-Yu Xia Jin-Tang Li Hui-Jun Cao Wen-Zhi Cai Jonghwan Suhr Zhi-Hao Zhang; supported by the Natural Science Foundation of Fujian Province(No.2022J01044);the Digital Twin and Intelligent Transportation Maintenance Engineering Research Centre of Genting Applied Technology R&D Platform at Xiamen City University。; Copper nanoparticles(CuNPs)have promising applications in energy storage,sensing,and chip manufacturing because of their excellent properties and low cost.However,oxidation limits their sinterability and performance a...; 关键词：air sintering Cu nanoparticle flexible sensor high-temperature antioxidant

Promoted monolithic perovskite/organic tandem solar cells through elaborate manipulation of light transmission and carrier tunneling in interconnect junction: 《Science China Chemistry》2024年第9期3131-3139,共9页Rongbo Wang Jiawei Zhang Juntao Zhao Ya Wang Yi Ding Ying Zhao Xiaodan Zhang Guofu Hou; supported by the Key Project of the Nature Science Foundation of Tianjin(22JCZDJC00120);the 111 Project(B16027)。; Monolithic perovskite/organic tandem solar cells(TSCs)have emerged as promising thin film solar cells.It is recognized that interconnect junction plays a pivotal role in tandem devices.Consequently,wide bandgap Cs_(0....; 关键词：tandem solar cells band alignment PEROVSKITE organic solar cells interconnect junction

A Non-parametric Gradient-Based Shape Optimization Approach for Solving Inverse Problems in Directed Self-Assemblyof Block Copolymers: 《Communications on Applied Mathematics and Computation》2024年第2期1472-1489,共18页Daniil Bochkov Frederic Gibou; supported by the NSF DMS 1620471.; We consider the inverse problem of finding guiding pattern shapes that result in desired self-assembly morphologies of block copolymer melts.Specifically,we model polymer selfassembly using the self-consistent field t...; 关键词：Block copolymers Directed self-assembly Inverse design Shape optimization Vertical interconnect accesses(VIA)

电沉积Mo和Mo-Co合金纳米线用于互联电阻的电阻率改性: 《Engineering》2024年第1期127-137,共11页Jun Hwan Moon Taesoon Kim Youngmin Lee Seunghyun Kim Yanghee Kim Jae-Pyoung Ahn Jungwoo Choi Hyuck Mo Lee Young Keun Kim; supported by the Basic Science Research Program of the National Research Foundation of Korea;funded by the Ministry of Education of the Republic of Korea(2021R1A6A3A13046504);the Ministry of Science and ICT of the Republic of Korea(2022M3H4A1A04096339 and 2020M3F3A2A01081585);the Samsung Electronics Co.,Ltd.(IO210317-08500-01).; Achieving historically anticipated improvement in the performance of integrated circuits is challenging,due to the increasing cost and complexity of the required technologies with each new generation.To overcome this ...; 关键词：MOLYBDENUM Molybdenum-cobalt INTERCONNECT Microstructure ELECTRODEPOSITION Density functional theory

Vertical serpentine interconnect-enabled stretchable and curved electronics被引量：2: 《Microsystems & Nanoengineering》2023年第6期165-174,共10页Rui Jiao Ruoqin Wang Yixin Wang Yik Kin Cheung Xingru Chen Xiaoyi Wang Yang Deng Hongyu Yu; supported by grants from the Innovation and Technology Commission(project:ITS-192-20FP)of HKSAR;the Research Grants Council of Hong Kong under the General Research Fund under Grant 16200919;Shenzhen-Hong Kong-Macao S&T Program(Category C,Grant No.SGDX20210823103200004);Hetao Shenzhen-Hong Kong Science and Technology Innovation Cooperation Zone under Project HZQB-KCZYB-2020083.; Stretchable and curved electronic devices are a promising technology trend due to their remarkable advantages.Many approaches have been developed to manufacture stretchable and curved electronics.Here,to allow such el...; 关键词：curved network ELECTRICAL

Circuit Modeling and Performance Analysis of GNR@SWCNT Bundle Interconnects: 《Chinese Journal of Electronics》2023年第6期1271-1277,共7页ZHAO Wensheng YUAN Mengjiao WANG Xiang WANG Dawei; supported by the Zhejiang Provincial Natural Science Foundation of China(LXR22F040001).; In this paper,the single-walled carbon nanotube(SWCNT)with graphene nanoribbon(GNR)inside,namely GNR@SWCNT,is proposed as alternative conductor material for the interconnect applications.The equivalent circuit model i...; 关键词：GNR@SWCNT bundle On-chip interconnect Equivalent circuit mode Time delay Repeater insertion

Approach to Simplify the Development of IoT Systems that Interconnect Embedded Devices Using a Single Program: 《Computers, Materials & Continua》2023年第11期2463-2480,共18页Enol Matilla Blanco Jordán Pascual Espada Rubén Gonzalez Crespo; Many Internet of Things(IoT)systems are based on the intercommunication among different devices and centralized systems.Nowadays,there are several commercial and research platforms available to simplify the creation o...; 关键词：IOT interconnected devices IoT platform programing devices devices coordination and communication

CXL (Compute Express Link) Technology: 《Journal of Computer and Communications》2023年第6期94-102,共9页Santhosh Nagaraj Nag; CXL (Compute Express Link) technology is a relatively new high-speed interconnect standard that was developed to enable faster communication between CPUs, GPUs, and other high-performance components in data center sys...; 关键词：CXL INTERCONNECT PROTOCOL MEMORY

An interconnect-free micro-electromechanical 7-bit arithmetic device for multi-operand programmable computing: 《Microsystems & Nanoengineering》2023年第2期355-366,共12页Xuecui Zou Usman Yaqoob Saly Ahmed Yue Wang Khaled Nabil Salama Hossein Fariborzi; Computational power density and interconnection between transistors have grown to be the dominant challenges for the continued scaling of complementary metal-oxide-semiconductor(CMOS)technology due to limited integrat...; 关键词：COMPUTING hardware OPERA

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