SnAgCu无铅微焊点剪切力学性能的体积效应  

Volume effect on shear strength of SnAgCu lead-free solder joints

作　　者：王春青[1] 王学林[1] 田艳红[1] 

机构地区：[1]哈尔滨工业大学现代焊接生产技术国家重点实验室,哈尔滨150001

出　　处：《焊接学报》2011年第4期1-4,113,共4页Transactions of The China Welding Institution

基　　金：国家自然科学基金资助项目(51075103);国家863高技术研究发展计划资助项目(2007AA04Z314)

摘　　要：对直径200-600μm的Sn3.0Ag0.5Cu无铅微焊点进行了多次重熔及老化试验,并采用专业的微小焊点力学性能测试仪DAGE4000测试了焊点的抗剪强度,分析了焊点体积差异对焊点抗剪强度的影响,发现SnAgCu无铅焊点的抗剪强度随着焊点体积增大呈下降趋势,体现出明显的体积效应.讨论了老化时间及重熔次数对不同体积焊点抗剪强度的影响关系,最后用扫描电镜（SEM）观察分析了剪切试样断口形貌,分析了焊点断裂失效机制.Sn3.0Ag0.5Cu lead-free solder joints of different sizes in the range of 200 μm to 600 μm were multi-reflowed and aged,and then the shear strength of those solder joints were tested by the micro-force tester DAGE4000.The effect of solder volume differences on the shear strength of solder joints was investigated.The results indicated that the shear strength of SnAgCu lead-free solder joints decreased with the increasing of the solder joint volume,showing an apparent volume effect.The effect of aging time and reflow times on the shear strength of solder joints with different sizes were also discussed,and scanning electron microscopy(SEM) was used to analyze the morphology of shear fracture,and the failure mechanism of solder joints were discussed.

关 键 词：无铅焊点 抗剪强度 体积效应 老化 多次重熔 

分 类 号：TG425.1[金属学及工艺—焊接] TG111.91