基体偏压对磁控溅射AlSn20镀层组织形貌与性能的影响  

Effects of Substrate Bias Voltage on Morphologies and Properties of Al-20Sn Coating Deposited by Non-equilibrium Magnetron Sputtering

作　　者：郭巧琴[1,2] 蒋百灵[1] 李建平[2] 吴兵[1] 

机构地区：[1]西安理工大学材料科学与工程学院 [2]西安工业大学材料与化工学院

出　　处：《特种铸造及有色合金》2011年第4期308-310,394,共3页Special Casting & Nonferrous Alloys

基　　金：陕西省教育厅专项科研计划项目(09JK481);陕西省薄膜技术与光学检测重点实验室开放基金资助项目

摘　　要：采用非平衡磁控溅射在铝基轴承合金表面制备了AlSn20镀层,分析不同基体偏压对AlSn20镀层的组织形貌、硬度、膜基结合力、摩擦因数等的影响。结果表明,非平衡磁控溅射AlSn20镀层,基体偏电压在-60～-120V范围内,镀层呈层状生长,随着基体偏电压增大,镀层由粗大结构向细晶结构变化,镀层硬度与基体偏电压成反比,当偏电压为-120V时,镀层硬度(HV0.025)最高为80,镀层与基体结合力最高可达35N,镀层的摩擦因数最低为0.15。The Al-20Sn coatings on aluminum bearing alloy were deposited by magnetron sputtering technology.Effects of substrate bias voltages on microstructure,hardness,bonding strength and frictional coefficient of the coatings were analyzed.It is found that coating exhibits lamellar growth with substrate bias voltage at-60～-120V.With increasing in substrate bias voltage,film structure is transformed from coarse structure to fine one.Hardness of the coatings is inversely proportional to the substrate bias voltage.With substrate bias voltage of-120V,hardness,bonding strength between coating and the substrate and frictional coefficient reach up to HV80,35N and 0.15,respectively.

关 键 词：磁控溅射 AlSn20镀层 组织 硬度 摩擦因数 

分 类 号：TB43[一般工业技术] TG146.21[一般工业技术—材料科学与工程]