SnAgCu焊点界面金属间化合物的研究现状  

Research status of intermetallic compounds in SnAgCu lead-free soldered joints

作　　者：姬峰[1] 薛松柏[1] 张亮 皋利利[1] 韩宗杰[1] 

机构地区：[1]南京航空航天大学 材料科学与技术学院,210016

出　　处：《焊接》2011年第4期20-26,69,共7页Welding & Joining

基　　金：江苏省普通高校研究生科技创新计划资助项目(CX07B-0872);2006年江苏省"六大人才高峰"资助项目(06-E-020)

摘　　要：SnAgCu系合金钎料是目前最有可能替代SnPb钎料的无铅钎料之一。其在回流焊过程中产生的界面金属间化合物是影响电子产品可靠性的重要因素。综述了SnAgCu钎料在Cu,Ni/Cu,Au/Ni/Cu衬底上回流焊后界面金属间化合物(IMC)的类型和产生过程,并对时效、热冲击、热循环过程中界面金属间化合物的形貌演变以及生长规律进行了评述。SnAgCu series filler alloy is one of the most promising candidates of lead-free solders to replace the conventional eutectic SnPb solders.Intermetallic compounds (IMCs) which formed in the reflow soldering process are one of the main factors to influence the reliability of electric products.The types and growth process of IMCs on the substrates of Cu,Ni/Cu and Au/Ni/Cu in reflowing soldering process with SnAgCu alloy were summarized.The evolution of morphology and growth rule of IMCs in the joints during aging,thermal cycle and thermal shocking process were presented.

关 键 词：SnAgCu钎料 回流焊 金属间化合物(IMC) 时效 

分 类 号：TG454[金属学及工艺—焊接]