次亚磷酸钠体系化学镀镍的电化学研究  

AN ELECTROCHEMICAL INVESTIGATION OF ELECTROLESS NICKEL DEPOSITION IN SODIUM HYPOPHOSPHITE-BASED BATH

作　　者：王美媛[1] 旷亚非[1] 

机构地区：[1]湖南大学化学化工学院,长沙410082

出　　处：《腐蚀与防护》1999年第8期339-342,372,共5页Corrosion & Protection

基　　金：国家自然科学基金资助项目(29773012)

摘　　要：运用阳极扫描法研究了次亚磷酸钠体系化学镀镍在镍电极上的电化学行为.结果表明,化学镀镍的两个分部反应之间存在着强烈的相互作用;次亚磷酸钠的直接氧化产物不是H_3PO_3,其氧化行为受自身浓度、溶液温度、pH值、扫描速度以及Ni^(2+)浓度的影响.The electrochemical behavior of electroless nickel deposition in sodium hypophosphite-based bath in nickel electrode was investigated by anodic sweep method. The results indicated that there was strong interaction between the two partial reactions involved in the electroless nickel deposition. The direct oxidation product of sodium hypophosphite was not H3PO3, and its oxidation behavior was affected by the concentration of sodium hy-pophosphite, temperature and pH of the bath, sweep rate and concentration of nickel ion.

关 键 词：次亚磷酸钠 化学镀 电化学方法 镀镍 电镀 

分 类 号：TQ153.12[化学工程—电化学工业]