Sn-0.7Cu-2Bi无铅钎料压入蠕变性能的研究  

Investigation on Indentation Creep Behavior of Sn-0.7Cu-2Bi Lead-free Solder

作　　者：廖春丽[1] 

机构地区：[1]南充职业技术学院机电工程系,四川南充637131

出　　处：《热加工工艺》2011年第9期17-19,共3页Hot Working Technology

基　　金：四川省教育厅重点培育项目(No.07ZZ033)

摘　　要：采用自制的蠕变装置研究Sn-0.7Cu-2Bi无铅钎料在温度60～120℃、压力30～50MPa下的压入蠕变性能,利用光学显微镜、SEM和XRD对钎料组织在蠕变前后的变化进行了分析。结果表明:随着温度和应力的增加,钎料的蠕变速率增大;Sn-0.7Cu-2Bi主要由Sn、Bi、Cu6Sn5三相组成,Bi固溶在Sn中造成晶格的畸变阻碍晶体滑移面的位错运动,导致其变形抗力大为增加,且晶界处偏聚的Bi颗粒对位错有钉扎作用,能提高钎料的抗蠕变性能;Sn-0.7Cu-2Bi钎料蠕变后出现回复再结晶,最终导致晶粒长大。With self-made apparatus,the indentation creep behavior of Sn-0.7Cu-2Bi lead-free solder was investigated at 60～120℃ under compressive stress of 30～50 MPa,and the change of the microstructure of lead-free solder before and after indentation creep were analyzed by optical microscope,SEM and XRD.The results indicate that the creep rate increases with temperature and compressive stress in creasing,the Sn-0.7Cu-2Bi is composed of Sn,Bi and Cu6Sn5 phases,lattice distortion generated by Bi solid-solving in Sn makes the dislocation movement of crystal siliding surface,which causes the deformation resistance of Sn-0.7Cu-2Bi increasing.Bi on the interfacial boundary serves as a pinning effect on dislocation which enhances the creep resistance of the solder;Sn-0.7Cu-2Bi lead-free solder generates recovery and recrystallization after creep,which results in the grain growth in the end.

关 键 词：Sn-0.7Cu-2Bi 无铅钎料 压入蠕变 

分 类 号：TG454[金属学及工艺—焊接]