SnCuNix-Pr焊点组织和性能分析  

Microstructures and solderability of SnCuNi-xPr lead-free solder

作　　者：罗家栋[1] 薛松柏[1] 曾广[1] 胡玉华[1] 

机构地区：[1]南京航空航天大学材料科学与技术学院,南京210016

出　　处：《焊接学报》2011年第5期57-60,116,共4页Transactions of The China Welding Institution

基　　金：江苏科技大学先进焊接技术省级重点实验室开放研究基金课题(JSAWT-09-02)

摘　　要：分析了不同稀土元素Pr的添加量对Sn0．7Eu0．05Ni无铅钎料润湿性能、焊点力学性能以及钎料显微组织的影响，并对焊点内部组织的演化规律与其性能之间的内在联系进行了初步探讨．研究发现，稀土元素Pr的适宜添加量为0．025％～0．075％，且存在一最佳添加量0．05％．微量稀土元素Pr的加入可显著降低液态钎料的表面张力，改善其润湿性，同时可对晶界迁移产生钉扎作用，细化焊点组织，提高焊点力学性能．过量Pr元素的加入会因其过度氧化及其所引起的应力场综合作用增大等原因导致其活性作用降低．Effects of rare earth element Pr on the wetting performance,mechanical properties and microstructures of Sn0.7Cu0.05Ni lead-free solder were studied.The inherent relationship between the microstructures and properties of the solder was preliminarily discussed.The experimental results show that the suitable amount of Pr addition is 0.025%-0.075%,and the most appropriate amount is 0.05%,at which composition the solder exhibits the best wetting performance and mechanical properties.The surface tension of the liquid solder was significantly reduced due to the addition of rare earth Pr and the wetting performance was improved.The microstructures of the soldered joints were evidently refined,which resulted from the pinning effect on the grain boundaries migration due to the addition Pr,and the shear strength was improved obviously.It was also found that the activity of the rare earth element of Pr may be reduced because of excessive oxidation and the enlargement of the comprehensive effect of stress field caused by excessive addition of Pr.

关 键 词：无铅钎料 稀土元素Pr 润湿性能 力学性能 显微组织 

分 类 号：TG115.28[金属学及工艺—物理冶金]