三维锡膏测厚误差补偿系统的研究  

Study on 3d Solder Paste Inspector Error Compensation System

作　　者：师雪超[1] 孙振忠[2] 卢盛林[2] 

机构地区：[1]华南理工大学机械与汽车工程学院,广东广州510640 [2]东莞理工学院机械工程学院,广东东莞523808

出　　处：《机电工程技术》2011年第5期98-102,126,共5页Mechanical & Electrical Engineering Technology

基　　金：东莞市科技计划(编号:200910814034);科技型中小企业技术创新基金项目(编号:09C26214402123)

摘　　要：针对三维锡膏测厚系统误差大,易受环境、操作员及操作方法等因素的影响的问题,提出了一种自适应误差补偿方法。使用图像分析法对图像质量进行评价,将评价结果反馈给控制系统,并使用黄金分割法作为搜索策略,实现了系统的自动对焦。提取非焊盘区域的点坐标拟合平面,建立了动态视场(FOV)基准面。实验结果表明,使用文中提出的方法,三维锡膏测厚系统有效消除了印刷电路板(PCB)的变形干扰,系统的测量能力强,测量精度较高。Because 3d solder paste inspector with large measurement error was vulnerable to environment,operators and operation method,etc,an adaptive error compensation method was proposed.Automatic focusing system was realized by evaluating the image quality using image quality analysis method,feeding the result back to control system and searching optical focus by the golden segmentation method.The dynamic reference plane which size was field of view(FOV) was established by fitting coordinates of non-pad regional points.Experimental results indicate that 3d solder paste inspector with adaptive error compensation method can eliminate error from PCB deformation effectively,which has stronger measurement ability and higher measurement precision.

关 键 词：三维锡膏测厚仪 误差补偿 自动对焦 动态基准面 

分 类 号：TG249.2[金属学及工艺—铸造]