新型芳炔基硅树脂及其复合材料的制备  

Preparation of Novel Silicon-Containing Ethynylarene Resin and Composites

作　　者：石松[1,2] 杨明[3] 孔磊[2] 赵彤[3] 张大海[1,2] 

机构地区：[1]天津工业大学,天津300160 [2]航天材料及工艺研究所,先进功能复合材料技术国防科技重点实验室,北京100076 [3]中国科学院化学研究所,北京100190

出　　处：《宇航材料工艺》2011年第1期38-41,共4页Aerospace Materials & Technology

摘　　要：利用三乙炔基苯基苯(TEPHB)对聚硅乙炔(PSA)进行改性,成功制备了一种新型芳炔基含硅杂化树脂(PSA-E),并使用该树脂基体制备了玻璃纤维增强复合材料。表征结果指出PSA-E树脂兼具良好的工艺性能与优异的耐高温性能,该树脂的固化过程较为温和且易于控制,其固化物的Td5高于500℃,900℃残重率大于89%(氮气条件下)。玻璃纤维增强PSA-E基复合材料的力学性能较PSA基复合材料有较大幅度的提高。Novel processable and heat-resistant silicon-containing resins（PSA-E resins） were successfully synthesized by the reaction of 1,3,5-tris-（4-ethynylphenyl）benzene（TEPHB） with silylene-acetylene polymer（PSA）.The DSC results show that the novel resins thermally cured at 200-250℃ with low exothermal heat possessed excellent heat resistant property and good process ability.The TGA results denote that the Td5（temperature of 5% weight loss） of the thermosets are above 500℃,and the overall char yields are above 89% at 900℃ under nitrogen.Based on the PSA-E resins,the glass fiber reinforced composites are prepared via press molding process.The study of themechanical properties indicate that,compared with glass fiber PSA resin,the flexural and shear strengths of the glass fiber PSA-E resin increased in a large extent.

关 键 词：硅基 乙炔基 树脂 复合材料 

分 类 号：TQ264.1[化学工程—有机化工]