基于镍钯金PCB的数字传声器键合工艺匹配研究  

Study on Bonding Technology of Digital Microphone of NiPdAu PCB

作　　者：于金伟[1] 

机构地区：[1]潍坊学院,山东潍坊261061

出　　处：《电子工艺技术》2011年第3期133-135,共3页Electronics Process Technology

基　　金：山东省国际科技合作计划项目(项目编号:201013)

摘　　要：介绍了数字传声器的关键结构,并基于其既有焊接又有键合工艺的特点,为提高PCB连接可靠性,特别是这种IC封装用PCB与芯片连接的可靠性,引入了镍钯金PCB,实现了其高可靠性的连接;并根据键合工艺的的要求,优化选择了键合温度、键合机台压力、功率和键合时间等工艺参数,进行了一系列引线键合实验,取得了键合点的相关实验数据,并对实验数据进行了分析,得出了对镍钯金PCB良好连接性能的相匹配的皮膜厚度参数。The structure of digital microphone is introduced.Ni-Pd-Au PCB is used based on the process technology characteristic with both soldering and bonding,in order to improve the reliability of PCB,especially the connect reliability between of PCB and IC.The high reliability connect is achieved.A series of bonding experiments have been done according to the demand of bonding technology,some related data and matched skin membrane thick parameter are obtained.

关 键 词：镍钯金PCB 数字传声器 引线键合 皮膜 

分 类 号：TN305.96[电子电信—物理电子学]