基于电场分析的掩膜电解加工试验研究  

A Study of Through Mask Electrochemical Machining with Electric Field Analysis

作　　者：郭紫贵[1] 凡进军[1] 

机构地区：[1]张家界航空工业职业技术学院,张家界427000

出　　处：《机械科学与技术》2011年第6期1016-1019,1024,共5页Mechanical Science and Technology for Aerospace Engineering

摘　　要：摩擦副表面的微小凹坑阵列结构可以存储润滑油,能大幅度降低摩擦副表面的磨损。采用掩膜电解的方式加工大面积微坑结构,具有工具制作简单,工件无内应力等诸多优点。采用有限元法对加工间隙内的电场进行了仿真分析,研究了胶膜厚度对阳极表面电流密度分布的影响。试验中用光刻的方法在阳极表面制作了尺寸均匀的胶膜,胶膜孔径400μm。在此基础上进行电解加工微坑试验,优化了加工参数,提高了凹坑阵列的加工精度。获得了平均直径可达450μm左右、深度30μm的凹坑阵列,凹坑形状规则,一致性好。Surface micro-pits array features are critical factors that reduce friction and wear, which can act as fluid reservoirs and play an important role in promoting the retention of a lubricating film. In this paper, an electrochemical machining （ECM） method with a mask onto the anode is proposed to produce the micro-pit array patterns. The influence of the mask thickness on the electric density distribution of the workpieee was studied by finite element simulation. The processing parameters are optimized to improve the accuracy of micro-pits array. The influence of the micro-pits with the diameter of 450μm and the depth of 30μm can be obtained while the mask-hole diameter of 400 μm is employed using the optimized processing parameters.

关 键 词：光刻 电解加工 凹坑阵列 

分 类 号：TG662[金属学及工艺—金属切削加工及机床]