PBGA焊点的热疲劳寿命分析  

THERMAL FATIGUE LIFE ANALYSIS ON THE PBGA SOLDER JOINT

作　　者：刘常康[1] 周德俭[1] 潘开林[1] 覃匡宇 

机构地区：[1]桂林电子工业学院电子机械系,桂林541004

出　　处：《机械强度》1999年第3期212-214,共3页Journal of Mechanical Strength

摘　　要：采用焊点阵列数学分析的方法得到阵列在热循环载荷作用下，由于元件、焊点及基板的热膨胀系数不匹配所产生的阵列对关键焊点的热位移影响。然后利用焊点成形软件得到焊点的形态，通过编制相关转换程序进行关键焊点的非线性有限元分析，从而得到关键焊点体内的最大应变值，利用低周热疲劳寿命预测公式得到焊点的热疲劳寿命。The thermal displacement on the critical solder joint is derved firstly from a mathematics analysis method on the joint array under the condition of CTE mismatch thermal loading among component,solder joint and substrate.In this work,the joint shape is determined with the application of a Surface Evolver program.In order to determine the maximum strain in the critical joint,a nonlinear FEM analysis is carried out with a conversion program.Finally,the thermal fatigue life of joint can be estimated through a low cycle thermal fatigue life expression.

关 键 词：BPGA焊点 有限元 热疲劳寿命 焊接 

分 类 号：TG404[金属学及工艺—焊接] TG405