无铅焊料Sn-3Ag-xSb系微观组织及焊接性研究  

Microstructure and Weldability of New Lead-free Solder Sn-3Ag-xSb

作　　者：吴建波[1] 赵振兴[1] 吕雪[1] 张飞[1] 

机构地区：[1]合肥工业大学材料科学与工程学院,安徽合肥230009

出　　处：《热加工工艺》2011年第11期32-34,共3页Hot Working Technology

摘　　要：采用定量的方法,研究Sn-3Ag-xSb(x取2,5,7)系新型无铅焊料的微观组织、润湿性以及焊接接头的性能,进而探究无铅焊料成分中Sb质量百分比的差异对焊料相关性能的影响。结果表明:在一定范围内随着Sb质量分数的增加,Sn-3Ag-xSb系无铅焊料组织晶粒得到细化,并且润湿性和焊接性能都得到了一定的提高。The microstructure,wettability and solder joint performance of new lead-free solder Sn-3Ag-xSb （x take 2,5,7） were studied by quantitative method,then the effects of Sb content on the solderability of the lead-free solder were investigsted. The results show that with the increase of Sb, the microstructure of Sn-3Ag-xSb lead-free solder is refined within a certain range. The solder wettability and performance can be improved to some extent.

关 键 词：无铅焊料 润湿性能 Sn-3Ag-xSb 

分 类 号：TG425[金属学及工艺—焊接]