Sn-3.5Ag合金在Cu,Ni倾斜基板的润湿及界面特性  

Wettability and interface layer characteristics of Sn-3.5Ag solder alloy with tilting copper and nickel substrates

作　　者：战亚鹏[1] 徐红艳[1,2] 王晨钰[1] 周舟[1] 袁章福[1,2] 张军玲[2] 赵宏欣[2] 

机构地区：[1]北京大学工学院,北京100871 [2]中国科学院过程工程研究所,北京100190

出　　处：《计算机与应用化学》2011年第6期680-684,共5页Computers and Applied Chemistry

摘　　要：良好的润湿性是优质焊料的重要指标,同时也可以为复合无铅焊料的开发提供必要的研究基础。而工业过程中的操作表面往往是倾斜的,因此,研究倾斜状态下的润湿特性更能反映实际情况。本文采用静滴法研究了不同温度下Sn-3.5Ag合金熔体在Cu,Ni材料水平基板和倾斜基板上的润湿行为与界面相互作用,分析了润湿机理。结果表明,Sn-3.5Ag合金与固体Cu基板在(494～744)K时的平衡接触角为139.2°～33.3°,接触角滞后为82.1°～47.8°。Sn-3.5Ag合金与固体Ni基板在(494～744) K时的接触角分别为140.8°～41.5°,接触角滞后为92°～60.9°。在不同温度下Sn-3.5Ag合金熔体在不同温度下与固体Cu基板之间有良好的润湿性且为反应性润湿。Sn-3.5Ag熔体与基板Cu之间的界面产物是由Cu_6Sn_5及Cu_3Sn所组成。用三相界面平衡的界面张力关系式分析了Sn-3.5Ag合金与Cu基板的三相界面,符合较好。Sn-3.5Ag对Ni基板的润湿过程也是反应性润湿。Good wettability is a key factor for excellent solder.The study of wetting behavior is an important step in the characterization of solder alloys and also provides basic physicochemical data for design and development of composite lead-free solder alloys.As operatings in various industrial processes were often on tilting surface,the study of wetting behavior on the inclined substrate could better reflect the actual situation. Sessile drop method was employed to investigate the wetting behavior of a new Sn-3.5 Ag solder alloy on Cu and Ni substrates under Ar-H_2 flow in the temperature（494～744）K.The result indicate that in（494～744）K,the contact angle between Sn-3.5 Ag and Cu substrate was 139.2°～33.3°,the contact angle hysteresis was 82.1°～47.8°.In（494～744）K,the contact angle between Sn-3.5 Ag and Ni substrate was 140.8°～41.5°,the contact angle hysteresis was 92°～60.9°.Among these solder alloys studied,the wettability of Sn-3.5 Ag alloy to the Cu substrates was excellent and reactivity wettability.Intermetallics（IMC）at the Sn-3.5 Ag/Cu interface are identified by EPMA analysis as Cu_6Sn_5 adjacent to the solder and Cu_3Sn adjacent to the Cu substrate,respectively.The configuration of the triple line of Sn-3.5 Ag/Cu is discussed by the description of equilibrium.The calculated results based on experimental values of tension balances along each of the three interfaces at this final state show good agreement with theoretical analysis.The wettability of Sn-3.5 Ag alloy to the Ni substrates was excellent and reactivity wettability..

关 键 词：无铅焊料 润湿性 接触角 界面层 Sn-3.5Ag合金 

分 类 号：TG425[金属学及工艺—焊接]