电感耦合等离子体原子发射光谱法测定Sn-Ag-Cu系焊锡中铅和镉  

Inductively coupled plasma atomic emission spectrometry determination of lead and cadmium in Sn-Ag-Cu system solders

作　　者：雷宏田[1] 王静[1] 毛亚蓉[1] 

机构地区：[1]中国第一汽车集团公司技术中心,吉林长春130011

出　　处：《冶金分析》2011年第5期71-73,共3页Metallurgical Analysis

摘　　要：样品用盐酸、过氧化氢溶解,在少量硫酸存在下,以盐酸和氢溴酸挥锡,电感耦合等离子体原子发射光谱法测定铅和镉的含量。优化了仪器的工作参数,对溶样酸和锡基体等影响因素进行了试验。本法测铅和镉的线性范围分别为0.50～5.00μg/mL和0.050～0.50μg/mL,检出限分别为13.2μg/L和0.9μg/L,样品测定结果的相对标准偏差(n=6)均小于4%,用标准加入法测得回收率分别为97%～108%和90%～96%。The solder samples were dissolved in hydrochloric acid and hydrogen peroxide.Then,the tin was removed by hydrochloric acid-hydrobromide in presence of little sulfuric acid,and the contents of lead and cadmium were determined by inductively coupled plasma atomic emission spectrometry（ICP-AES）.The working parameters of ICP instrument were optimized.The influencing factors such as acid for dissolving sample and tin matrix were tested.The linear ranges in this method were obtained between 0.50-5.00 μg/mL（for Pb） and 0.050-0.50 μg/mL（for Cd）.The detection limits were 13.2 μg/L for Pb and 0.9 μg/L for Cd,respectively.The relative standard deviations（RSD,n=6） were less than 4 %.The recoveries rate for lead and cadmium obtained by standard addition method were 97 %-108 % and 90 %-96 % respectively.

关 键 词：电感耦合等离子体原子发射光谱法 焊锡 铅 镉 

分 类 号：TG115.33[金属学及工艺—物理冶金]