镀层表面锡晶须自发生长现象的研究进展  

Research development of tin whisker spontaneous growth on plating surface

作　　者：石红昌[1] 冼爱平[1] 

机构地区：[1]中国科学院金属研究所沈阳材料科学国家(联合)实验室,沈阳110016

出　　处：《中国有色金属学报》2011年第5期1021-1030,共10页The Chinese Journal of Nonferrous Metals

基　　金：国家自然科学基金资助项目(50871119)

摘　　要：镀层表面锡晶须自发生长是材料科学中一个受到长期关注的科学现象。随着近年来电子器件无铅化的发展,锡晶须问题日益突出。对于高密度电子封装技术,由晶须自发生长引起的短路和电子故障问题对电子产品的可靠性构成了潜在的威胁。因此,研究锡晶须的生长规律,阐明锡晶须的生长机理,探寻抑制锡晶须生长的技术手段成为当前研究的热点。总结了近年来国内外对锡晶须生长现象的一些相关研究,主要包括锡晶须的生长行为、各种影响锡晶须生长的因素、近年来晶须生长机制方面的新进展、锡晶须生长趋势的评估方法以及工业上抑制晶须生长的一些技术措施等。The spontaneous growth of tin whiskers on plating surface is a scientific phenomenon which is focused in materials science for long time.With the development of lead-free in electronic devices,the problems resulting from tin whiskers are going up.The spontaneous growth of tin whiskers can cause short-circuit or breakdown of electronic products,which can be the potential problems for the reliability issue of the high density electronic packaging technology.Therefore,it is an important crux to study the influencing factors on whisker growth,seek the way to the mitigation whisker growth and understand the mechanism of whisker growth.The researches and new development on the phenomenon of the tin whisker growth were reviewed,which included the behaviors of tin whisker growth,various influencing factors,recent development in the mechanism of the whisker growth,the evaluation way for whisker growth trend,and some way to the mitigation whisker growth in the industry.

关 键 词：电镀 锡晶须 生长机理 无铅焊料 

分 类 号：TQ153.13[化学工程—电化学工业]