半导体激光器高速同轴封装设计  

Design of High-Speed Semiconductor Lasers with Coaxial Package

作　　者：谭科民[1] 柴广跃[2] 黄长统[2] 段子刚[2] 

机构地区：[1]中国电子科技集团公司第十三研究所,石家庄050051 [2]深圳大学教育部光电器件与系统重点实验室,深圳518060

出　　处：《半导体技术》2011年第7期566-569,共4页Semiconductor Technology

摘　　要：在光纤接入网等光通信领域,低成本高速同轴封装半导体光电器件有着非常重要的作用。对于高速TO-can激光器(LD),由于已进入微波工作频段,封装以及相关元件的分布参数已经成为制约高速激光器性能的主要参数之一,分析了同轴封装结构的技术特点,建立了激光器器件及封装相关元件的等效电路模型,利用商用CAD分析软件对其进行了模拟和优化设计,为半导体激光器高速同轴封装设计的工艺方案、封装材料的选择提供了依据,并据此进行了部分相关实验。Low cost semiconductor optoelectronic devices with coaxial packages play an important role in optical fiber communication access network fields.Because it works at microwave bands for high-speed TO-can LDs,distribution parameters of package and other devices are the one of key parameters that restrict the capacity of high-speed LDs.The structure of coaxial packages was analyzed.The equivalent circuit models of LDs,other devices and packages were established,and it was simulated and optimized by the commercial CAD soft.It provided evidence for the technics design of high-speed semiconductor lasers with coaxial package and the selection of packages materials,and some experiments were made for TO-can LDs.

关 键 词：同轴封装 半导体激光器 高速 等效电路模型 接入网 

分 类 号：TN365[电子电信—物理电子学] TN305.94