陶瓷化学镀铜沉积速度及镀层外观的研究  

Study on Deposition Rate and Coating Appearance of Electroless Copper Plating on Ceramics

作　　者：张敏[1] 宣天鹏[1] 孙衍乐[1] 许少楠[1] 

机构地区：[1]合肥工业大学材料科学与工程学院,安徽合肥230009

出　　处：《电镀与精饰》2011年第7期5-9,共5页Plating & Finishing

摘　　要：探讨了硫酸铜质量浓度、络合剂质量浓度比例、甲醛质量浓度、稀土质量浓度及温度变化对陶瓷表面化学镀铜的沉积速率和镀铜层微观形貌的影响。结果表明:随着硫酸铜质量浓度的增加、温度的升高和络合比的降低,化学镀铜的沉积速率提高,但镀液稳定性有所降低;增加甲醛或稀土含量,镀速先升高后下降,有一个最佳值。加入稀土Ce细化了铜颗粒,铜在基体表面的沉积变得均匀,当ρ(硫酸铈)为0.8g/L时,镀铜层平整细密、孔洞较少。Effects of copper sulfate concentration,complexing agent concentration ratio,formaldehyde concentration,rare earth content and temperature on copper deposition rate,coating microstructure of electroless copper plating on ceramic were discussed.Results showed that with the increase in copper sulfate concentration and temperature and decrease in complexing agent ratio,the Cu deposition rate was increased but bath stability decreased;with increasing formaldehyde concentration and rare earth content,the Cu deposition rate was increased at first and then decreased.By adding rare earth Ce salt,copper particles got refined and copper depositon became even,especially when cerium sulfate content was 0.8g/L,copper coating became more level,finer and less pores.

关 键 词：电子陶瓷 化学镀铜 络合比 稀土 

分 类 号：TQ153.3[化学工程—电化学工业]