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作 者:邵传兵[1,2] 刘红[1] 苑永涛[1] 方敬忠[1]
机构地区:[1]中国科学院光电技术研究所,成都610209 [2]中国科学院研究生院,北京100039
出 处:《材料导报(纳米与新材料专辑)》2011年第1期217-219,共3页
摘 要:采用磁控溅射技术制备了SiC/Cu层状复合材料,研究了Cu层厚度对SiC/Cu层状复合材料力学性能的影响。结果表明,保持SiC层厚度为0.5μm不变,层状复合材料的断裂能和极限拉伸强度随Cu层厚度的增大先增加后降低,在Cu层厚度为8μm时出现峰值,断裂能和极限拉伸强度分别为2080.3MJ/m^3和565MPa。分析认为,在拉伸过程中金属Cu层发生塑性变形和Cu层拔出是SiC/Cu层状复合材料力学性能增强的主要原因。SiC/Cu laminated composites were prepared by a magnetron sputtering. The influence of the thickness of Cu layer on the mechanical properties of the SiC/Cu laminated composites were studied. The results show that, kee-ping the SiC lay invariable at the thickness of 0. 5μm, the toughness and ultimate tensile strength of SiC/Cu laminated composites increase with the increasing of the thickness of Cu layer from 2μm to 8/μm, however, these mechanical properties decrease while the thickness of Cu layer is more than 8μm. The maximum of the toughness and ultimate tensile strength of SiC/Cu laminated composites are 2080. 3MJ/m^3 and 565MPa respectively. This can be ascribed to the plastic deformation and pump out of the Cu ductile metal layers.
分 类 号:TB331[一般工业技术—材料科学与工程]
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