Cr/Cu/Ag/Cu/Cr新型银基复合薄膜电极的防氧化性能研究  

Oxidation Resistance of Novel Ag-Based Cr/Cu/Ag/Cu/Cr Composite Film Electrodes

作　　者：翁卫祥[1] 贾贞[1] 于光龙[1] 李昱[1] 郭太良[1] 

机构地区：[1]福州大学物理与信息工程学院,福州350002

出　　处：《真空科学与技术学报》2011年第4期381-385,共5页Chinese Journal of Vacuum Science and Technology

基　　金：福州大学博士基金(No.826768);国家"863"计划重大专项(2008AA03A313);福建省重大科技专项(2004HZ01-2)

摘　　要：采用直流磁控溅射技术和光刻工艺制备了Cr/Cu/Ag/Cu/Cr复合薄膜及其电极,研究不同温度热处理对复合薄膜和电极结构、表面形貌和电性能的影响。Ag层与最外层的Cr层之间的Cu层不仅增强了Cr和Ag之间的粘附力,而且起到了牺牲层和氧气阻挡层的作用;Cr和Cu对Ag的双重保护使得薄膜电极在温度小于500℃时电阻率保持较为稳定,约为3.0×10-84.2×10-8Ω·m之间。然而由于电极表面氧化和边沿氧化的共同作用,薄膜电极的电阻率在热处理温度超过575℃出现了显著的上升。尽管如此,Cr/Cu/Ag/Cu/Cr薄膜电极仍然是一种能够承受高温热处理并且保持较低电阻率的新型电极,满足场发射平板显示器封接过程中的热处理要求。The novel type of electrode,fabricated with the Ag-based Cr/Cu/Ag/Cu/Cr composite layers deposited by DC magnetron sputtering and by lithography,was developed.The microstructures and properties of the composite layers,before and after annealing,were characterized with X-ray diffraction,scanning electron microscopy,and conventional surface probes.The impacts of the growth conditions on the composite layers were evaluated.We found that while acting as the oxygen diffusion barrier,the Cu layer improves the adhesion at the interface of Cr and Ag.Besides,low temperature annealing,say 500℃,little affects the resistivity of the electrode possibly because the Cu and Cr layers protect Ag against oxidation.The results show that the novel Cr/Cu/Ag/Cu/Cr electrode with favorable properties,such as low resistivity,high oxidation resistance,good stability in high temperature annealing,especially in high temperature sealing,may be the promising material in fabricating field emission flat display panel.

关 键 词：Cr/Cu/Ag/Cu/Cr薄膜 薄膜电极 表面形貌 防氧化性能 

分 类 号：TN104.3[电子电信—物理电子学]