电子封装中的固相焊接:引线键合  

Solid Phase Welding in Electronics Packaging: Wire Bonding

作　　者：宗飞 黄美权 叶德洪 苏庆侠 刘赫津 

机构地区：[1]飞思卡尔半导体(中国)有限公司,天津300385

出　　处：《电子工业专用设备》2011年第7期34-39,共6页Equipment for Electronic Products Manufacturing

摘　　要：引线键合是电子封装中最常用的IC互连方法,其在键合过程中及键合完成后具有固相焊接的特征。将键合过程分为冲击、接触和键合三阶段,并联系实际键合机台的基本键合时序,发现接触参数及超声功率和连接压力的大小关系对优质焊点的形成有重要影响;键合完成后的金属原子扩散将有助于金属间化合物的生长,但金属间化合物的过度生长将在界面形成开裂和孔洞而造成键合焊点失效。Wire bonding is the most popular method for IC connection in electronics packaging and it has the characterization of solid phase welding whether during or after bonding.This paper divided wire bonding into 3 phases,impact,contact and bond,and it＇s found that the contact parameters and the relationship between ultrasonic power and bonding force affect the quality of ball bonds greatly.The diffusion after wire bonding controls the growth of intermetallic compounds while the over-growth introduces cracking and voids at the interface which will destroy the ball bonds.

关 键 词：引线键合 键合时序 接触参数 键合参数 扩散 

分 类 号：TN405.96[电子电信—微电子学与固体电子学]