基于硅片的SMA薄膜微驱动器驱动原理与模拟  

Mechanic Analysis and Simulation of SMA Thin Film Microactuator Based on Si Substrate

作　　者：王莉[1] 蔡炳初[1] 张明生[1] 徐东[1] 

机构地区：[1]上海交通大学信息存储研究中心,上海200030

出　　处：《微细加工技术》1999年第4期38-46,共9页Microfabrication Technology

摘　　要：建立了ＳＭＡ 薄膜／基片的耦合数学模型，对溅射在基片上的ＳＭＡ 薄膜产生驱动的过程进行了仿真模拟，结果表明ＳＭＡ 薄膜／ 基片的耦合驱动是双金属效应和形状记忆效应的双重结果，该驱动力比单纯双金属效应产生的驱动力大得多。该模型对于实际应用ＳＭＡ 薄膜／基片结构进行微驱动的器件设计具有理论指导意义。Mathematical model and simulation for the driving process of the coupled structure by sputtering shape memory alloy thin films on Si substrates are proposed.The results show that the driving stress is due to bi metal effect and shape memory effect simultaneously and it is much larger than that caused only by bi metal effect.This model is very useful for designing and simulating SMA/Si microactuators.

关 键 词：微驱动器 硅基片 模拟 SMA薄膜 微机电系统 

分 类 号：TP271.4[自动化与计算机技术—检测技术与自动化装置]