元器件破坏性物理分析方法的定制开发  

Development of Custom Destructive Physical Analysis for Components

作　　者：张磊[1] 王旭[1] 

机构地区：[1]中国空间技术研究院电子元器件可靠性中心,北京100029

出　　处：《电子产品可靠性与环境试验》2011年第4期17-20,共4页Electronic Product Reliability and Environmental Testing

摘　　要：随着航天器研制技术的不断进步,大量不同于传统半导体器件的新型元器件以及微组装结构的组件级元器件越来越多地被选用,在对这些类别的元器件进行破坏性物理分析(DPA)时没有可适用的标准规范,采用定制开发的技术方法是解决途径之一。通过对某型视频处理组件的DPA工程实践案例的介绍,探讨了DPA方法的定制开发过程以及需要重点关注的事项。More new components and micro-assembly modules which are different from the traditional semiconductor devices are selected as the advances of the spacecraft technology.However,there are no suitable standard methods for performing destructive physical analysis（DPA） on such components.The customization of DPA is one of the solutions.Based on a practical DPA case of a processing module,the development of a custom DPA and the aspects which should be focused on during the DPA process are discussed in this paper.

关 键 词：微组装元器件 破坏性物理分析 定制开发 

分 类 号：TN602[电子电信—电路与系统]