功率型LED封装键合材料的有限元热分析  

Finite Element Thermal Analysis on Package Bonding Materials of Power Type LED

作　　者：刘一兵[1,2] 

机构地区：[1]湖南大学电气与信息工程学院,长沙410082 [2]邵阳职业技术学院机电工程系,湖南邵阳422000

出　　处：《半导体光电》2011年第4期517-520,共4页Semiconductor Optoelectronics

基　　金：湖南省科技计划项目(2010GK3182);邵阳市科技计划项目(C0926)

摘　　要：建立了功率型LED结构,分析了其热阻模型,对采用高导热导电银胶、纳米银焊膏、大功率芯片键合胶、Sn70Pb30四种键合材料的LED进行了ANSYS有限元软件仿真对比研究。结果表明,纳米银焊膏具有最优的传热特性。采用了正向电压法对3W蓝光LED进行了热阻测量,其数值与仿真结果基本相符,验证了模拟仿真结果的真实性。The structure of power type LED was established, and its thermal resistance model was analyzed. The LEDs fabricated with four bonding materials of high thermal conductivity silver paste, nano-silver paste, high power chip bonding glue, and SnTOPb30 respectively were simulated comparatively by using ANSYS finite element software. The results show that nano-silver paste has the best heat transfer characteristic. Forward voltage method was used to measure the heat resistancein of a 3 W blue LED, and the tested value agree well with the simulation results.

关 键 词：功率型LED 键合材料 热阻 ANSYS有限元分析软件 正向电压法 

分 类 号：TN312.8[电子电信—物理电子学]