基于磨料水射流的多晶硅车削试验与建模  

Experiment and modeling of turning polysilicon using abrasive water jet

作　　者：卫排锋[1] 雷玉勇[1] 刘克福[1] 蒋代君[1] 王荣娟[1] 

机构地区：[1]西华大学机械工程与自动化学院机械电子工程与自动化研究所,四川成都610039

出　　处：《矿山机械》2011年第10期133-136,共4页Mining & Processing Equipment

基　　金：四川省教育厅项目(09ZZ030/09ZB085/09ZA116)

摘　　要：笔者通过进行磨料水射流车削多晶硅片的试验研究,说明了磨料水射流车切多晶硅这类脆性材料的可行性。磨料水射流车削多晶硅的表面质量主要受射流压力、进给速度、靶距和主轴转速的影响。在正交试验设计的基础上,采用回归分析方法,在磨料水射流车削多晶硅过程中,建立了主要加工工艺参数对表面粗糙度影响模型。通过对该模型的相关指标的分析表明,回归方程有一定指导意义。该模型为合理选择磨料水射流车削工艺参数提供了理论基础,在半导体制造业具有较大应用价值。Turning polysilicon using abrasive water jet is experimentally studied. The experimental results show that it is practicable for abrasive water jet to turn brittle materials such as polysilicon. Turning parameters such as pressure and feed rate of the water jet, target distance and rotary speed of main shaft etc. play influential roles on the quality of polysilicon surface turned by abrasive water jet. Based on the orthogonal experimental design, regression analysis method is applied to establish the model by which influences of main manufacturing parameters on surface roughness are included during turning polysilicon by abrasive water jet. Through analysis on related indexes of the model, it shows that the regression equation has some guidance significance. The model offers theoretical basis for reasonably selecting parameters for turning polysilicon by abrasive water jet, and has great application value in semiconductor manufacturing industry.

关 键 词：磨料水射流 磨料水射流切割 车削 多晶硅 半导体 

分 类 号：TG51[金属学及工艺—金属切削加工及机床]