Sn-X-Cu-Ni无铅焊料的显微组织和性能研究  

Microstructure and Properties of Sn-X-Cu-Ni Solder

作　　者：李伟[1] 陈海燕[1] 揭晓华[1] 郭黎 

机构地区：[1]广东工业大学材料与能源学院,广东广州510006 [2]高新锡业有限公司,广东惠州516123

出　　处：《热加工工艺》2011年第17期4-6,共3页Hot Working Technology

基　　金：省部产学研结合项目(2010B090400207)

摘　　要：为了获得低成本和性能良好的无铅焊料,本文对Sn-X-Cu-Ni焊料的微观组织及物相成分、熔点、润湿性和抗拉强度进行了分析研究。结果表明,Sn-X-Cu-Ni焊料中主要由βSn、XSn化合物和Cu6Sn5化合物组成,Sn-X-Cu-Ni焊料合金的熔点随X含量增加而增高;当X的含量为4.5%时,焊料的铺展性最好,抗拉强度也最大。In order to obtain the low cost and the good performance of lead-free solder.The microstructure,ingredients,melting point,wettability and tensile strength of Sn-X-Cu-Ni lead-free solder were studied.The results show that Sn-X-Cu-Ni lead-free solder is mainly composed of βSn,XSn compound and Cu6Sn5 compound,the Sn-X-Cu-Ni solder alloy＇s melting point increases along with X content inereasing;When X content is 4.5%,the solder spread-eagle is best,the tensile strength is also biggest.

关 键 词：无铅焊料 显微组织 熔点 铺展性 抗拉强度 

分 类 号：TG425[金属学及工艺—焊接]