并联焊头机构的误差分析  

The Error Model Analysis of the Parallel Bonder

作　　者：温兆麟[1] 彭卫东[2] 

机构地区：[1]广州航海高等专科学校,广东广州510725 [2]广东工贸职业技术学院,广东广州510510

出　　处：《机床与液压》2011年第18期51-53,共3页Machine Tool & Hydraulics

摘　　要：影响焊头运动精度和定位精度的因素很多,如驱动器行程误差、运动副间隙和机构杆件热变形等。应用直接微分法,建立并联焊头机构的位置误差模型。根据建立的模型,确定前进和后退时焊头的最大位置误差。结果表明对焊头进行误差补偿是十分必要的。There are a lot of factors that influence the moving precision and position accuracy of the IC die bonder, such as driver moving error, clearance of moving pairs and thermal deformation error etc. The position error model of the mechanism was established by using the direct-differential method. The max position errors were obtained, when the bonder went forward and backward. The resuits show it is necessary to develop the position error compensating model of the bonder.

关 键 词：误差建模 并联焊头机构 直接微分法 

分 类 号：TH6[机械工程—机械制造及自动化]