基于机器视觉的IC芯片粘片机的精度测量研究  

Study of Accuracy Measuring of IC Chip Die Based on Machine Vision

作　　者：彭卫东[1] 吴志伟[1] 

机构地区：[1]广东工贸职业技术学院,广东广州510510

出　　处：《机床与液压》2011年第18期103-105,共3页Machine Tool & Hydraulics

摘　　要：基于机器视觉的原理,在所设计的实验平台上对高速、高加速度IC芯片粘片机并联焊头机构的定位精度进行了测量,测量和处理方法具有简单、容易实现及成本低的优点。实验结果表明:拾片和焊片时定位精度分别达到28.4、18.1μm,满足IC芯片粘片机工作的需要。Based on machine vision, position accuracy of parallel bonding mechanism of high speed and high acceleration IC chip die was measured in an experimental platform. The advantages of the measuring and calculating method are simple, easy realizing and low cost. The experimental results indicate that picking position accuracy is 28.4 μm and placing position accuracy is 18. 1 μm. So the designed mechanism can meet the working requirements of the IC die.

关 键 词：并联焊头机构 机器视觉 精度测量 

分 类 号：TH6[机械工程—机械制造及自动化]