SMT锡膏检测中基于Delphi与OpenGL的锡膏三维显示  

3D Demonstration of Solder Paste Based on Delphi and OpenGL in SMT Solder Paste Inspection

作　　者：马勇平[1] 章云[1] 罗兵[2] 

机构地区：[1]广东工业大学自动化学院,广东广州510006 [2]五邑大学信息工程学院,广东江门529020

出　　处：《计算技术与自动化》2011年第3期95-99,共5页Computing Technology and Automation

基　　金：教育部广东省产学研项目(2010B090400026)

摘　　要：研究在Delphi下采用OpenGL编程显示锡膏三维形态的方法,并且实现旋转、缩放及根据锡膏厚度显示不同的颜色等功能。实验结果表明:在Delphi7.0平台上采用OpenGL编程实现锡膏三维形态实时动态显示不仅可以避免大量的矩阵运算、减少程序代码长度、提高编程效率,而且能够提高图形的显示效果。In this paper,a method about how to program in Delphi with OpenGL to demonstrate the 3D shape of solder paste is presented.It also realizes some functions such as rotating,scaling and displaying different color according to the thickness of solder paste.Experimental results show that programming in Delphi with OpenGL to demonstrate the 3D shape of solder paste dynamically can not only avoid a lot of matrix operation,reduce the length of the program code,enhance the efficiency of programming,but also improve the demonstration effect of graphics.

关 键 词：OPENGL DELPHI 双缓存技术 锡膏三维模型 

分 类 号：TP391[自动化与计算机技术—计算机应用技术]