纳米压痕法分析Sn-9Zn/Cu焊点力学性能  

Analysis of Sn-9Zn/Cu solder joints mechanical properties using nano indentation

作　　者：陈永生[1] 孟工戈[1] 孙静[1] 

机构地区：[1]哈尔滨理工大学材料科学与工程学院,黑龙江哈尔滨150040

出　　处：《电子元件与材料》2011年第11期65-67,共3页Electronic Components And Materials

摘　　要：通过对Sn-9Zn/Cu焊点进行纳米压痕实验发现:在保载阶段,体钎料产生了明显的蠕变特征,蠕变深度随着加载速率的增加而增加。基于压痕做功概念确定了Sn-9Zn/Cu焊点中体钎料的蠕变应力指数n约为5.128。硬度和弹性模量测试结果表明:金属间化合物Cu5Zn8的压痕硬度(5.152±0.224)GPa约是体钎料压痕硬度(0.178±0.020)GPa的30倍;前者弹性模量(123.100±20.024)GPa又是后者弹性模量(25.615±9.077)GPa的5倍,显示了影响焊点可靠性的关键因素是焊点界面处的金属间化合物。Through the nano indentation experiments of the Sn-9ZrdCu solder joints, it was found that bulk solder had obvious creep characteristics at the holding time and with the loading rate increase, the creep depth also gained. The creep stress exponent n of Sn-gZr/Cu bulk solder obtained from curves with the concept of＂work of indentation＂ was 5.128. The hardness and elastic modulus test results show that the indentation hardness of CusZn8 （5.152±0.224） GPa is about 30 times of the bulk solder （0.178±0.020） GPa. The elastic modulus of CusZn8 （123.100±20.024） GPa is about five times of the bulk solder （25.615±9.077） GPa, and this shows IMC is the key factor that affects the reliability of solder joints.

关 键 词：SN-9ZN 纳米压痕:蠕变应变速率敏感指数 

分 类 号：TN306[电子电信—物理电子学]