热处理工艺对Al/Cu双金属复合界面的影响  

Effect of heat treatment on the interface of Al/Cu bimetal laminated material

作　　者：张锐[1] 林高用[1,2] 王莉[1] 张胜华[1,2] 宋佳胜[1] 

机构地区：[1]中南大学材料科学与工程学院,湖南长沙410083 [2]中南大学有色金属材料科学与工程教育部重点实验室,湖南长沙410083

出　　处：《兵器材料科学与工程》2011年第5期5-8,共4页Ordnance Material Science and Engineering

基　　金：国家十一五科技支撑计划项目(2009BAE71B04)

摘　　要：采用POLYVAR-MET型金相显微镜、带有GENESIS60S能谱仪的Sirion200场发射扫描电镜对经高温和低温退火处理的Al/Cu双金属复合界面组织进行观察分析,研究热处理工艺对界面组织及扩散层厚度的影响规律,并进一步通过冷轧实验研究扩散层厚度与界面结合强度的关系,获得综合满足材料结合强度和成型性能的热处理工艺。结果表明：高温退火处理的Al/Cu复合试样难以实现稳定的塑性成型,低温退火处理能使界面结合牢固,冷变形塑性好;Al/Cu双金属复合材料的界面扩散结合层厚度的最佳范围为1.2~3.5μm;最佳工艺为低温退火加热到300~350℃,保温45~60 min。fect of heat treatment on the interface morphology and diffusion thickness of Cu/Al bimetal interface was investigated by means of POLYVAR-MET metalloscope,Sirion200 scanning electron microscopy with GENESIS60S energy spectrum.And the relation between the diffusion layer thickness and interface bonding strength was studied to obtain a heat treatment process for the requirement of bonding strength and moulding performance.The results show that it is difficult for Cu/Al laminated material to realize the stable plastic forming by high temperature annealing,while low temperature annealing can realize steady interface bonding.There is an optimum range for the thickness of Cu/Al diffusion,which is from 1.2 μm to 3.5 μm.The optimum process for steady interface bonding of Cu/Al laminated material is low temperature annealing at 300 ℃ to 350 ℃,and holding for 45 min to 60 min.

关 键 词：Al/Cu双金属层压复合材料 界面结合 扩散 低温退火 塑性成型 

分 类 号：TG146.13[一般工业技术—材料科学与工程]