无托槽隐形矫治微型测力系统的建立  

Establishment of the micro-stress sensor measurement system for invisible aligner technique

作　　者：任超超[1] 白玉兴[1] 王喆垚[2] 张敏[2] 

机构地区：[1]首都医科大学口腔医学院正畸科,100050 [2]清华大学微电子系

出　　处：《中华口腔医学杂志》2011年第10期600-603,共4页Chinese Journal of Stomatology

基　　金：国家自然科学基金（30872914）

摘　　要：目的建立无托槽隐形矫治微型测力实验平台，以测量矫治过程中牙齿的应力。方法开发基于硅衬底的应力传感器芯片，随后进行芯片减薄，并采用四点弯曲结构进行压阻系数标定，使用超薄的柔性电路板封装传感器芯片，引出信号，搭建完整的隐形矫治应力测量实验平台。结果制造完成的应力传感器芯片长7．0him、宽6．0mm、厚0．1mm，其上包括13个注入制造的单晶硅压阻应力敏感单元和4个标定单元；设计制造了基于多路选择电路的主测试电路板，搭建了完整的隐形矫治应力测量实验平台，通过压阻阻值的测量计算出13个测量单元位置所在的应力。结论建立了无托槽隐形矫治微型测力系统的实验平台，为精确测量矫治过程中牙齿的局部应力提供了方法。Objective To design and build the micro-stress sensor measurement system for invisible aligner technique. Methods A measurement system based on silicon-on-insulator piezoresistive stress sensor was developed. A four-point-bending based experimental apparatus was constructed to calibrate the piezoresistive coefficients of this stress sensor. A chemical-mechanical polishing process was developed for thinning the stress sensor dies. A packaging solution using flexible printed circuit to get signals out was designed. Results The developed silicon stress sensor chip was 7.0 mm ×6. 0 mm x0. 1 mm in size, and 13 sensor rosettes and 4 calibration rosettes were fabricated in one sensor. And a main testing PCB and a Lab View program were designed to carry out the automation measurement of the stress sensor. The stress state during the process was obtained through this test system. And measuered the stress of the 13 sensor unit. Conclusions A stress measurement system was established for measuring stress during orthodontic treatment with invisable aligner.

关 键 词：正畸保持器 正畸学 矫正 牙应力分析 隐形矫治器 

分 类 号：R783.5[医药卫生—口腔医学]