无卤无磷阻燃覆铜板基板材料的研究  

Research on Halogen-free and Phosphorus-free Flame Retardant Base Material for CCL

作　　者：徐宝升[1] 刘立柱[1,2] 周佩君 翁凌[1] 金镇镐[1] 朱兴松[1] 

机构地区：[1]哈尔滨理工大学材料科学与工程学院,哈尔滨150040 [2]哈尔滨理工大学工程电介质及其应用教育部重点实验室,哈尔滨150040 [3]广东超华科技股份有限公司,广东梅州514759

出　　处：《绝缘材料》2011年第5期5-7,16,共4页Insulating Materials

摘　　要：将自制的含氮苯并噁嗪树脂与E-51环氧树脂共混,以共混树脂体系作为基体树脂浸渍玻璃纤维布,制成了一种新型无卤无磷阻燃覆铜板基板材料,分析了不同含量E-51环氧树脂对板材的电性能、弯曲强度、极限氧指数和热稳定性的影响,结果表明:E-51的加入能够提高板材的电性能、弯曲强度、热稳定性,但降低了板材的极限氧指数;当E-51含量为65%时,所得的浸渍胶液具有较好的储存稳定性。Using homemade-benzoxazine mixed with E-51 epoxy as matrix resin,a kind of novel halogen-free and phosphorous-free flame retardant base material was prepared by impregnating glass cloth.The effects of various contents of E-51 epoxy resin on the electrical properties,flexural strength,limit oxygen index and thermal stability of the base material were studied.The results show that the addition of E-51 can increase the electrical properties,flexural strength and thermal stability of the material,but decrease the limit oxygen index.When the E-51 content is 65%,the impregnating resin shows excellent storage stability.

关 键 词：苯并口恶嗪树脂 覆铜板 无卤无磷阻燃剂 环氧树脂 

分 类 号：TM215.6[一般工业技术—材料科学与工程] TQ323.5[电气工程—电工理论与新技术]