GIDL current degradation in LDD nMOSFET under hot hole stress  

GIDL current degradation in LDD nMOSFET under hot hole stress

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作  者:陈海峰 马晓华 过立新 杜慧敏 

机构地区:[1]School of Electronic Engineering,Xi'an University of Posts and Telecommunications [2]School of Technical Physics,Xidian University

出  处:《Journal of Semiconductors》2011年第11期43-46,共4页半导体学报(英文版)

基  金:supported by the Specialized Research Fund of the Education Department of Shaanxi Province,China(No.11JK0902);the Innovational Fund for Applied Materials of Xi'an,China(No.XA-AM-201012)

摘  要:The degradation of gate-induced drain leakage (GIDL) current in LDD nMOSFET under hot holes stress is studied in depth based on its parameter IDIFF. IDIFF is the difference of GIDL currents measured under two conditions of drain voltage VD = 1.4 V and gate voltage VG = -1.4 V while FoG is fixed. After the stress GIDL currents decay due to holes trapping in the oxide around the gate-to-drain overlap region. These trapped holes diminish A Ex which is the deference of the lateral electrical field of these two symmetrical measurement conditions in the overlap region so as to make IDIFF lessening. IOIFF extracted from GIDL currents decreases with increasing stress time t. The degradation shifts of IDIFF, MAX (A IDWF, MAX) follows a power law against t: △IDIFF' MAX (x t^m, m = 0.3. Hot electron stress is performed to validate the related mechanism.The degradation of gate-induced drain leakage (GIDL) current in LDD nMOSFET under hot holes stress is studied in depth based on its parameter IDIFF. IDIFF is the difference of GIDL currents measured under two conditions of drain voltage VD = 1.4 V and gate voltage VG = -1.4 V while FoG is fixed. After the stress GIDL currents decay due to holes trapping in the oxide around the gate-to-drain overlap region. These trapped holes diminish A Ex which is the deference of the lateral electrical field of these two symmetrical measurement conditions in the overlap region so as to make IDIFF lessening. IOIFF extracted from GIDL currents decreases with increasing stress time t. The degradation shifts of IDIFF, MAX (A IDWF, MAX) follows a power law against t: △IDIFF' MAX (x t^m, m = 0.3. Hot electron stress is performed to validate the related mechanism.

关 键 词:GIDL hot hole LDD band-to-band 

分 类 号:TN386[电子电信—物理电子学]

 

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