大功率LED低热阻封装技术进展  

Advances in Low Thermal Resistance Packaging for High-power LEDs

作　　者：陈明祥[1,2] 

机构地区：[1]华中科技大学机械学院 [2]武汉光电国家实验室MOEMS研究部,武汉430074

出　　处：《半导体光电》2011年第5期599-605,共7页Semiconductor Optoelectronics

基　　金：国家自然科学基金项目(50875012);国家科技支撑计划项目(2011BAE01B14)

摘　　要：散热是大功率LED封装的关键技术之一,散热不良将严重影响LED器件的出光效率、亮度和可靠性。影响LED器件散热的因素很多,包括芯片结构、封装材料(热界面材料和散热基板)、封装结构与工艺等。文章具体分析了影响大功率LED热阻的各个因素,指出LED散热是一个系统概念,需要综合考虑各个环节的热阻,单纯降低某一热阻无法有效解决LED的散热难题。文中还对国内外降低LED热阻的最新技术进行了介绍。Thermal management can greatly affect the luminous efficiency,brightness and reliability of LED devices.Many factors are involved in the thermal management of LED package,such as chip structure,packaging materials（thermal interface materials and heat spreader）,packaging structure and packaging processing.In this paper,some factors affecting the thermal resistance of high-power LED devices are analyzed in detai.It is indicated that thermal management of LED package is a systematic concept,each thermal resistance in thermal path should be considered synthetically,so decreasing only one of them cannot solve the problem of thermal management.Moreover,latest advances for reducing the thermal resistance are presented.

关 键 词：LED封装 散热 热阻 热界面材料 散热基板 

分 类 号：TN312.8[电子电信—物理电子学]