Diamond breakage on CMP pad conditioner  

Diamond breakage on CMP pad conditioner

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作  者:Liu Ping-Hsiao Sung James C. Hsu Kai-Hung Sung Michael 

机构地区:[1]National Taipei University of Technology [2]KINIK Company,64,Chung-San Rd.,Ying-Kuo [3]National Taiwan University [4]Advanced Diamond Solutions,Inc.,351 King Street Suite 813,San Francisco,CA 94158,U.S.A.

出  处:《金刚石与磨料磨具工程》2008年第S1期115-118,共4页Diamond & Abrasives Engineering

摘  要:Diamond grits may be thermally weakened during the high temperature cycle of brazing.This weakening may exhibit as diamond breakage.During the dressing action,taller diamond grits are more likely to break due to the higher stress present.Diamond grits may be thermally weakened during the high temperature cycle of brazing.This weakening may exhibit as diamond breakage.During the dressing action,taller diamond grits are more likely to break due to the higher stress present.

关 键 词:DIAMOND BRAZING DIAMOND BREAKAGE CMP PAD CONDITIONER 

分 类 号:TQ164[化学工程—高温制品工业]

 

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