氮离子注入印制板钻头试验研究  

Test of Nitrogen Ion Implantation Printed Circuit Board Drills

作　　者：张振学[1] 朱绍华[1] 谭俊[1] 

机构地区：[1]装甲兵工程学院工艺教研室,北京100072

出　　处：《装甲兵工程学院学报》1997年第2期93-96,共4页Journal of Academy of Armored Force Engineering

摘　　要：研究了氮离子注入印制板钻头后对基体材料的显微硬度的影响.在实际中比较了注入和未注入钻头的钻孔效果及钻头的磨损状况;并用AES的方法分析了氮离子注入后工件表面的元素分布情况,探讨了氮离子注入的强化机制.In this paper ,the influences of microhardness of printed circuit board drills caused by nitro-gen ion implantation are investigated, the drilling effects and wearing of drills between the implantation and non-implantation are compared in reality. AES method is used to analyze the distribution of elements on the surface of workpiece after nitrogen ion is implanted. The strengthening mechanism is also discussed.

关 键 词：离子注入 印制板 钻头 氮离子 

分 类 号：TN405[电子电信—微电子学与固体电子学]