柔性基板模块封装技术  

Packaging Technology for Flexible PCB Module

作　　者：江平[1] 

机构地区：[1]中国西南电子技术研究所,成都610036

出　　处：《电讯技术》2011年第11期117-120,共4页Telecommunication Engineering

摘　　要：针对柔性基板模块封装过程中存在的材料选择、叠层方式以及层间干涉等关键问题,提出了采用热应力分析进行材料筛选,通过3D结构叠层以及夹具隔离支撑措施,实现满足电磁兼容、热传导及振动要求的模块整体封装。这些方法和技术可用在适应性要求高的异形空间。Due to the key problem about material choosing, folding method and interbedded interference during the packaging of flexible PCB module, an approach based on caloric stress analysis, 3D structure and interbedded insulating support is proposed in this paper. It can satisfy electromagnetic compatibility（EMC）, heat exchange and the vibration criterion. These technical methods can apply to abnonnity space with high adaptability requirement.

关 键 词：军用电子设备 柔性基板 模块封装 折叠方式 异形空间 电磁兼容 

分 类 号：TN80[电子电信—信息与通信工程]