温度对碳化硅粉体表面镀镍的影响  

The Effect of Temperature on the Electroless Ni on the SiC Powder

作　　者：姚怀[1] 许波[1] 王永志[1] 

机构地区：[1]河南科技大学材料科学与工程学院,洛阳471003

出　　处：《表面技术》2011年第6期71-73,共3页Surface Technology

基　　金：河南科技大学青年科学研究基金(2007QN0007);河南科技大学大学生训练计划(2010204)

摘　　要：为改善碳化硅陶瓷粉体与金属的润湿性,在碱性条件下,以水合肼为还原剂,采用化学镀方法在碳化硅粉体表面沉积镍层,结合镀层的表面形貌、组织结构和实验现象,研究了镀液温度对镀镍的影响,此外还研究了水合肼用量对镀速的影响。结果表明:反应温度为70,75,80℃时,所得包覆粉体的表面镀层由颗粒状、胞状的Ni组成,基体完全被镀层覆盖,碳化硅表面镀层颗粒为类球状;75,80℃下制备的包覆粉体,镀镍层均匀且较厚。To improve the wettability of SiC powder and metal, the surface of SiC powders was plated with a Ni plating in the basic solution according to the reaction theory of electroless plating. Combined with the coating surface morphology, organization structure and experimental phenomenon, the influence of the temperature to coating surface and hydrazine hydrate to plating speed was researched. The results show that the temperature is 70 ℃, 75℃ and 80℃, the SiC coating surface is composed of granular, cellular and globe-like Ni, the subsrate is covered of Ni plating completely. When the temperature is 75℃ and 80℃, the coating particles on the surface is uniformity and relatively thick.

关 键 词：化学镀 碳化硅 温度 

分 类 号：TQ153.1[化学工程—电化学工业]