气态二聚体裂解温度对Parylene C膜力学和透气性能的影响  

Influence of Gas Dimers Pyrolysis Temperature on Tensile Strength and Gas Transmission of Parylene C Film

作　　者：吉祥波[1] 陈志[1] 陈慧[1] 唐贤臣[1] 

机构地区：[1]中国工程物理研究院,四川绵阳621900

出　　处：《高分子材料科学与工程》2011年第11期77-80,共4页Polymer Materials Science & Engineering

摘　　要：通过控制气态环状二聚体原料的裂解温度,在不同裂解温度下合成Parylene C膜,分析了裂解温度对膜的微观组织、拉伸性能和透气性能的影响。研究结果表明,当温度低于600℃时,原料裂解不充分,膜中存在大量未裂解原料的球状聚集体,导致膜的拉伸强度降低,气体透过率较高;当裂解温度达到720℃,气态原料存在部分过度裂解,裂解温度在630℃~690℃时,原料的裂解较充分,而且过裂解程度较小,制备的膜综合性能优异。In this study,Parylene C films were prepared by polymerization of gas monomers pyrolysised at different temperature.Influence of the pyrolysis temperature on micrographs,tensile strength and gas transmission property of Parylene C film was discussed.The results show that tensile strength decreases and gas transmission increases due to some congeries of dimmers pyrolysised inadequately embedded in films when pyrolysis temperature is less than 600 ℃.Some dimers are pyrolysised overly at 720 ℃.Performance of the films which prepared by gas dimers pyrolysised at 630 ℃～690 ℃ is excellent.

关 键 词：PARYLENE C 透气性能 裂解温度 化学气相沉积 

分 类 号：TB383[一般工业技术—材料科学与工程]