并联焊头机构运行曲线的优化  

The Optimization of the Parallel Bonder's Moving Curve

作　　者：彭卫东[1] 吴志伟[1] 

机构地区：[1]广东工贸职业技术学院,广东广州510510

出　　处：《机电工程技术》2011年第11期64-66,共3页Mechanical & Electrical Engineering Technology

摘　　要：建立了并联焊头机构的运动学方程,采用S型速度控制曲线,对焊头的运行轨迹进行了优化,得出了焊头的最优运行曲线。仿真结果显示:采用所选择的速度控制曲线时,焊头的加速度、速度和位移曲线比较平滑,机构运行平稳,冲击、振动较小,满足焊头的工作要求。The kinematic equations of the parallel bonder have been established in this paper, and S speed curve has been selected as motion controlling curve of this mechanism. The Optimal moving curve of the parallel bonder has been obtained by optimizing its moving curve. The simulated results indicate that its acceleration, velocity and displacement curves are smooth. Therefore the bonder moves smoothly, its impact and vibration are small and it can meet to the bonder＇ s work requirements.

关 键 词：并联焊头机构 控制曲线 运行轨迹 仿真 

分 类 号：TH6[机械工程—机械制造及自动化]