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作 者:金晓云[1] 胡艳[1] 沈瑞琪[1] 叶迎华[1]
出 处:《火工品》2011年第5期24-28,共5页Initiators & Pyrotechnics
基 金:南京理工大学自主科研专项计划资助项目(No.2010GJPY011)
摘 要:利用硅基氧化铝模板制备出具有较大物理接触面积的嵌入式A1/Ni纳米复合材料。首先,在0.3M草酸、40V条件下通过阳极氧化技术制备硅基多孔氧化铝薄膜;其次,以多孔氧化铝薄膜为模板电沉积制备Ni纳米棒;最后,在Ni纳米棒表面溅射一层Al膜形成嵌入式结构。采用场发射扫描电镜(FESEM)清晰地描述了嵌入式Al/Ni纳米复合材料的形成过程,并且X射线能谱衍射(EDS)谱图记录了制备过程中不同阶段样品元素组成的变化。X射线衍射(XRD)谱图表明制备的Ni纳米棒为多晶结构,DSC测试结果显示嵌入式Al/Ni纳米复合材料具有良好的热反应活性,在微热源和起爆装置中有潜在的应用价值。由于嵌入式Al/Ni纳米复合材料与硅基相兼容,因而可集成到MEMS器件中。Embedded Al/Ni nanocomposition was prepared using porous alumina membrane (PAM) on silicon (Si) substrate. Firstly, the PAM was fabricated by anodization in 0.3M oxalic acid and under constant of 40V, then the PAM was used to deposit Ni nanorods by dectrodeposition, finally an Al layer was deposited on the Ni nanorods to form the embedded Al/Ni nanocomposition. Emission scanning electron microscopy (FESEM) was used to show the formation process of the AI/Ni clearly, and changes of elements of the samples in different stages were recorded by an energy dispersive X-ray (EDS) analyzer. XRD pattem indicated the Ni nanorods had a polycrystalline structure, and DSC result showed the reactivity of Al/Ni was very high. The Al/Ni nanocomposition has the potential application to a he, at source or ignition, and could be integrated into MEMS device.
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