微连接焊点热循环可靠性的研究进展  

Review on Reliability of Micro-Solder Joints Subjected to Thermal Cycling

作　　者：李聪[1,2] 陈继兵[1,2] 安兵[1,2] 吴懿平[1,2] 

机构地区：[1]武汉光电国家实验室,湖北武汉430074 [2]华中科技大学连接与电子封装中心,湖北武汉430074

出　　处：《电子工艺技术》2011年第6期316-320,329,共6页Electronics Process Technology

基　　金：国家自然科学基金项目(项目编号:60876070)

摘　　要：介绍了国内外关于微连接焊点热循环可靠性的研究进展。热循环的作用会使焊点内部组织粗化、IMC长大和变厚和锡基无铅焊料重结晶等,诱发焊点中裂纹的萌生与扩展。主流观点认为,焊点的失效是一种疲劳与蠕变相结合的机制。分析了对未来无机械应力作用的单一焊点样品进行热循环实验的意义。影响焊点热循环寿命的因素有焊料成分、焊盘UBM层、焊盘形式以及热循环测试条件等。叙述了焊点热循环寿命的预测方法,简要介绍了几种焊点热循环寿命预测模型的特点。A review on reliability of micro-solder joints subjected to thermal cycling is presented.The effects of thermal cycling on the microstructure of solder joints include coarsening behavior,inter-metallic growth and re-crystallization behavior of lead free solder joints.Consequently it can harm the mechanical performance of solder joints as well as cause the initiation and propagation of cracks among them,which eventually lead to the breakup of components.Based on the review,point out that future work focus on the development of micro-structure of solder joints without the effect of mechanical stress under thermal cycling would be of great value.The mainly accepted standpoint for the thermal cycling failure of solder joints is fatigue and creep mechanism.There are many factors affect the life time of solder joints during thermal cycling,such as the composition of solder joints,the structure of UBM layer,the style of pads and the thermal cycling test conditions.Finally,the method for life prediction of solder joints is stated and several major fatigue models are summarized.

关 键 词：热循环 微观组织 失效机制 寿命预测 预测模型 

分 类 号：TN60[电子电信—电路与系统]