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作 者:刘波 冯志红 张森 敦少博 尹甲运 李佳 王晶晶 张效帏 房玉龙 蔡树军
机构地区:[1]Science and Technology on ASIC Laboratory,Hebei Semiconductor Research Institute [2]School of Materials Science and Engineering,Harbin Institute of Technology
出 处:《Journal of Semiconductors》2011年第12期68-71,共4页半导体学报(英文版)
基 金:Project supported by the National Natural Science Foundation of China(Nos.60890192,60876009).
摘 要:We report high performance InA1N/GaN HEMTs grown on sapphire substrates. The lattice-matched InA1N/GaN HEMT sample showed a high 2DEG mobility of 1210 cmZ/(V.s) under a sheet density of 2.6 × 10^13 cm^-2. Large signal load-pull measurements for a (2 × 100 μm) x 0.25 μm device have been conducted with a drain voltage of 24 V at 10 GHz. The presented results confirm the high performances reachable by InAIN- based technology with an output power density of 4.69 W/ram, a linear gain of 11.8 dB and a peak power-added efficiency of 48%. This is the first report of high performance InA1N/GaN HEMTs in China's Mainland.We report high performance InA1N/GaN HEMTs grown on sapphire substrates. The lattice-matched InA1N/GaN HEMT sample showed a high 2DEG mobility of 1210 cmZ/(V.s) under a sheet density of 2.6 × 10^13 cm^-2. Large signal load-pull measurements for a (2 × 100 μm) x 0.25 μm device have been conducted with a drain voltage of 24 V at 10 GHz. The presented results confirm the high performances reachable by InAIN- based technology with an output power density of 4.69 W/ram, a linear gain of 11.8 dB and a peak power-added efficiency of 48%. This is the first report of high performance InA1N/GaN HEMTs in China's Mainland.
关 键 词:InA1N/GaN HEMT output power density metal-organic chemical vapor deposition
分 类 号:TN304[电子电信—物理电子学]
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