大功率LED封装散热关键问题的仿真  

Key Factors in Cooling of High-power LED Packages

作　　者：李爱玉[1,2] 朱文章[1,2] 

机构地区：[1]厦门理工学院数理系,福建厦门361024 [2]厦门理工学院光电工程技术研究中心,福建厦门361024

出　　处：《厦门理工学院学报》2011年第4期10-13,22,共5页Journal of Xiamen University of Technology

基　　金：国家自然科学基金项目(50909084);厦门市科技计划项目(3502Z20093039)

摘　　要：基于ANSYS有限元软件对目前3种典型LED封装结构的温度场进行模拟分析.通过比较得出,优化封装结构可以有效地提高LED散热性能,途径最佳的是减少热沉数量,次之为降低热沉热阻;经与热对流方式对LED散热效果比较,发现优化封装结构降低结温的效果并不明显.而在可实现的光转换效率下,经过必要的选材优化后,强制对流是最有效解决散热的方法.Using the ANSYS software based on the finite-element method, the heat distribution of the LED in three different package structures are simulated and compared, and the effect of the different package structure on the ability of high power LED cooling capacity is analyzed. The effect of the air convection on the cooling for the LED package is also presented. It shows that forced cooling is the key to solve the LED cooling problem.

关 键 词：大功率LED 散热 封装结构 有限元 对流 

分 类 号：TN312.8[电子电信—物理电子学] TN305.94