铝电解电容SMT无铅工艺技术分析  

Analysis about the SMT Lead-free Process Control of Aluminum Electrolytic Capacitor

作　　者：黄勤陆[1] 肖甘[1] 

机构地区：[1]成都纺织高等专科学校,四川成都611731

出　　处：《新技术新工艺》2011年第12期61-63,共3页New Technology & New Process

摘　　要：介绍了SMT技术,并重点介绍了铝电解电容器SMT无铅工艺技术。为满足欧盟关于电子电气设备中限制使用某些有害物质和报废指令(即WEEE和ROHS指令),通过一个案例分析了铝电解电容在无铅生产中遇到的问题和解决办法。The paper introduced surface mount technology, and emphasized the SMT lead-free process control of aluminum electrolytic capacitor. The technology is to meet the solder ability requirement of EU directive for forbidden harmful matter and Waste matter from Electrical and electronic equipment （WEEE and RollS）. The paper has given an example which analyses problems and ways about aluminum electrolytic capacitor in the course of production.

关 键 词：铝电解电容器 SMT 无铅焊接 工艺控制 

分 类 号：TN605[电子电信—电路与系统]