人造板胶黏剂热压固化的介电监测技术开发  

In-situ Dielectric Observation of Adhesive Curing Behavior During the Wood-based Panel Hot-pressing Process

作　　者：潘斌[1] 孙华林[1] 程放[1] 李小群[1] 石芷萍[1] 

机构地区：[1]中国林科院木材工业研究所国家林业局木材科学与技术重点实验室,北京100091

出　　处：《木材工业》2012年第1期20-23,共4页China Wood Industry

基　　金：引进国际先进林业科学技术项目(2008-4-72)

摘　　要：应用介电损耗测量法,开发对人造板胶黏剂热压固化过程进行现场监测的技术。阐述该技术的监测原理,具体的应用方法以及装置组成。计算介电损耗所需的两个重要参数,即介电损耗角正切值和介电常数,分别通过数字电桥和同面叉指电极电容传感器进行测量。该方法的应用实例表明,利用此项技术,可有助于改进人造板胶黏剂的配方,优化热压工艺。A dielectric method for monitoring adhesive curing behavior during the wood-based panel hot pressing process was developed by the authors.The principle of this technique was based on the change of dielectric loss during adhesive solidification.The dielectric loss factor was calculated by a dielectric constant which could be measured by embedded capacitor sensors and the dielectric loss angular tangent value.A field study verified that the in situ monitoring results could provide prompt feedback for optimizing adhesive formulation and the wood-based panel hot-pressing process.

关 键 词：现场固化监测 胶黏剂 热压 

分 类 号：TS653[轻工技术与工程] TQ43[化学工程]