多层板涨缩性层偏改善方法及监控方式解析  

Multilayer board expansion layer partial improvement method and monitoring analysis

作　　者：龚俊 陈涛 张晃初 赵启祥 李加余 

机构地区：[1]胜宏科技(惠州)有限公司,广东惠州516211

出　　处：《印制电路信息》2012年第1期28-33,共6页Printed Circuit Information

摘　　要：随着线路板压合结构的复杂化,差异较大的内层芯板常被设计在一起。但由于芯板特性,工艺流程,菲林涨缩的差异,会导致在压合过程中,芯板由于伸缩比例不一致,而出现层间对准度偏移,以致内短报废的风险。本文通过对此类叠构层偏失效模式分析、验证,最终确认真因是由于层间涨缩差异导致。而针对涨缩性层偏,本文详细介绍了分层补偿方法,原则,相关治工具孔平移,两组同心圆层偏监控方式等,并将这一套改善对策导入实验板进行验证,最终得出本文介绍的涨缩性层偏改善方法及监控方式对改善层间涨缩性层偏有效,且效果明显。With the circuit board pressing structure becoming complex,difference of inner core plate is often designed to work together.But because the core board characteristics,process flow,film expansion difference,which will result the emergence of interlayer alignment offset and short risk in the pressing process,due to the core plate expansion ratio of inconsistency.Through to the stacking layer partial failure mode analysis,this article validated and finally confirmed the conclusion that interlayer expansion differences is the reason.And according to the expanding layer difference,this paper introduces the hierarchical compensation method,principle,related tools hole translation,two groups of concentric layers of partial monitoring means,and the set of measures to improve introduction experiment board for validation and finally obtains the expansion layer partial improvement method and monitoring means to improve interlayer collapsible layer partial effectively,which shows the obvious effect.

关 键 词：多层板 涨缩性层偏 分层补偿 两组同心圆 

分 类 号：TN41[电子电信—微电子学与固体电子学]